Tik: Powerline Module, Tipe montering: Surface Mount, Pakket / saak: 50-SSIP Module, Verskaffersapparaatpakket: 50-SIP Module,
Tik: Digital Micromirror Device (DMD), Tipe montering: Surface Mount, Pakket / saak: 98-CLCC, Verskaffersapparaatpakket: 98-LCCC (20.7x9.1),
Tik: Digital Micromirror Device (DMD), Tipe montering: Surface Mount, Pakket / saak: Module, Verskaffersapparaatpakket: 80-LCCC (20.7x9.1),
Tik: Digital Micromirror Device (DMD),
Tik: Multi-Queue Flow-Control, Tipe montering: Surface Mount, Pakket / saak: 256-BBGA, Verskaffersapparaatpakket: 256-BGA (17x17),
Tik: Floating-Point Co-Processor, Tipe montering: Through Hole, Pakket / saak: 18-DIP (0.300", 7.62mm), Verskaffersapparaatpakket: 18-DIP,
Tik: Floating-Point Co-Processor, Tipe montering: Through Hole, Pakket / saak: 8-DIP (0.300", 7.62mm), Verskaffersapparaatpakket: 8-DIP,