Tik: Wire Solder, Samestelling: Sn99.3Cu0.7 (99.3/0.7), Deursnee: 0.020" (0.51mm), Smeltpunt: 441°F (227°C), Vloeitipe: No-Clean, Water Soluble, Draadmeter: 24 AWG, 25 SWG,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 423 ~ 428°F (217 ~ 220°C), Vloeitipe: No-Clean,
Tik: Wire Solder, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Deursnee: 0.015" (0.38mm), Smeltpunt: 423 ~ 428°F (217 ~ 220°C), Vloeitipe: No-Clean, Water Soluble, Draadmeter: 27 AWG, 28 SWG,
Tik: Wire Solder, Samestelling: Sn99.3Cu0.7 (99.3/0.7), Deursnee: 0.031" (0.79mm), Smeltpunt: 441°F (227°C), Vloeitipe: No-Clean, Water Soluble, Draadmeter: 20 AWG, 22 SWG,
Tik: Solder Sphere, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.022" (0.56mm), Smeltpunt: 361°F (183°C),
Tik: Solder Sphere, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Deursnee: 0.020" (0.51mm), Smeltpunt: 423 ~ 428°F (217 ~ 220°C),
Tik: Solder Sphere, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.008" (0.20mm), Smeltpunt: 361°F (183°C),
Tik: Solder Paste, Samestelling: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Smeltpunt: 281°F (138°C), Vloeitipe: No-Clean,
Tik: Wire Solder, Samestelling: Sn99.3Cu0.7 (99.3/0.7), Deursnee: 0.031" (0.79mm), Smeltpunt: 441°F (227°C), Vloeitipe: No-Clean, Water Soluble, Draadmeter: 20 AWG, 21 SWG,
Tik: Solder Sphere, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.024" (0.61mm), Smeltpunt: 361°F (183°C),
Tik: Wire Solder, Samestelling: Sn99.3Cu0.7 (99.3/0.7), Deursnee: 0.015" (0.38mm), Smeltpunt: 441°F (227°C), Vloeitipe: No-Clean, Water Soluble,
Tik: Wire Solder, Samestelling: Sn99.3Cu0.7 (99.3/0.7), Deursnee: 0.031" (0.79mm), Smeltpunt: 441°F (227°C), Vloeitipe: No-Clean, Water Soluble,
Tik: Solder Sphere, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.030" (0.76mm), Smeltpunt: 361°F (183°C),
Tik: Wire Solder, Samestelling: In97Ag3 (97/3), Deursnee: 0.031" (0.79mm), Smeltpunt: 289°F (143°C), Draadmeter: 20 AWG, 21 SWG,
Tik: Wire Solder, Samestelling: Bi57Sn42Ag1 (57/42/1), Deursnee: 0.030" (0.76mm), Smeltpunt: 281°F (138°C), Draadmeter: 21 AWG, 22 SWG,
Tik: Solder Sphere, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.020" (0.51mm), Smeltpunt: 361°F (183°C),
Tik: Wire Solder, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.031" (0.79mm), Smeltpunt: 361°F (183°C), Vloeitipe: No-Clean, Water Soluble, Draadmeter: 20 AWG, 21 SWG,
Tik: Solder Paste, Samestelling: Sn63Pb37 (63/37), Smeltpunt: 361°F (183°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn63Pb37 (63/37), Smeltpunt: 361°F (183°C), Vloeitipe: Water Soluble,
Tik: Wire Solder, Samestelling: Sn62Pb36Ag2 (62/36/2), Deursnee: 0.020" (0.51mm), Smeltpunt: 354°F (179°C), Vloeitipe: No-Clean, Water Soluble,
Tik: Solder Sphere, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Deursnee: 0.016" (0.40mm), Smeltpunt: 423 ~ 428°F (217 ~ 220°C),
Tik: Wire Solder, Samestelling: Sn95Sb5 (95/5), Deursnee: 0.020" (0.51mm), Smeltpunt: 450 ~ 460°F (232 ~ 238°C), Vloeitipe: Rosin Activated (RA), Draadmeter: 24 AWG, 25 SWG,
Tik: Wire Solder, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.024" (0.61mm), Smeltpunt: 361°F (183°C), Vloeitipe: Water Soluble, Draadmeter: 22 AWG, 23 SWG,
Tik: Wire Solder, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Deursnee: 0.040" (1.02mm), Smeltpunt: 423 ~ 424°F (217 ~ 218°C), Vloeitipe: Rosin Activated (RA), Draadmeter: 18 AWG, 19 SWG,
