Tik: Solder Paste, Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 423°F (217°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn63Pb37 (63/37), Smeltpunt: 361°F (183°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 423°F (217°C),
Tik: Solder Paste, Smeltpunt: 546 ~ 567°F (286 ~ 297°C),
Tik: Wire Solder, Samestelling: Sn60Pb40 (60/40), Deursnee: 0.064" (1.63mm), Smeltpunt: 361 ~ 374°F (183 ~ 190°C), Vloeitipe: No-Clean, Draadmeter: 14 AWG, 16 SWG,
Tik: Wire Solder, Samestelling: Sn96.5Ag3.5 (96.5/3.5), Deursnee: 0.063" (1.60mm), Smeltpunt: 430°F (221°C), Draadmeter: 14 AWG, 16 SWG,
Tik: Solder Paste, Samestelling: Sn63Pb37 (63/37), Smeltpunt: 361°F (183°C), Vloeitipe: Water Soluble,
Tik: Wire Solder, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.032" (0.81mm), Smeltpunt: 361°F (183°C), Vloeitipe: Rosin Mildly Activated (RMA), Draadmeter: 20 AWG, 21 SWG,
Tik: Wire Solder, Samestelling: Sn63Pb37 (63/37), Deursnee: 0.022" (0.56mm), Smeltpunt: 361°F (183°C), Vloeitipe: Rosin Mildly Activated (RMA), Draadmeter: 23 AWG, 24 SWG,
Tik: Solder Paste, Samestelling: Bi58Sn42 (58/42), Smeltpunt: 281°F (138°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Smeltpunt: 411 ~ 424°F (209 ~ 218°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Smeltpunt: 410 ~ 424°F (209 ~ 218°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Smeltpunt: 409 ~ 424°F (209 ~ 218°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Smeltpunt: 408 ~ 424°F (209 ~ 218°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 350°F (177°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 401 ~ 424°F (205 ~ 218°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Smeltpunt: 423°F (217°C), Vloeitipe: No-Clean,
Tik: Solder Paste, Samestelling: Sn62Pb36Ag2 (62/36/2), Smeltpunt: 354°F (179°C), Vloeitipe: Water Soluble,
Tik: Solder Paste, Samestelling: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Smeltpunt: 423°F (217°C), Vloeitipe: Water Soluble,