Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: TSSOP, Pitch: 0.020" (0.50mm), Borddikte: 0.062" (1.57mm) 1/16",
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: TSSOP,
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: SOIC, Borddikte: 0.062" (1.57mm) 1/16",
Proto-bordtipe: SMD to DIP, Pakket aanvaar: PSOP, SSOP, TSOP, Borddikte: 0.062" (1.57mm) 1/16",
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: QFP, Borddikte: 0.062" (1.57mm) 1/16",
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: PLCC, Borddikte: 0.062" (1.57mm) 1/16",
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: TQFP,
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: SOIC,
Proto-bordtipe: SMD to Plated Through Hole Board, Pakket aanvaar: SOIC, Pitch: 0.020" (0.50mm), Borddikte: 0.062" (1.57mm) 1/16",